1 # SPDX-License-Identifier: GPL-2.0-only
3 # Generic thermal drivers configuration
9 Thermal drivers offer a generic mechanism for
10 thermal management. Usually it's made up of one or more thermal
11 zones and cooling devices.
12 Each thermal zone contains its own temperature, trip points,
14 All platforms with ACPI or Open Firmware thermal support can use
16 If you want this support, you should say Y here.
20 config THERMAL_NETLINK
21 bool "Thermal netlink management"
24 The thermal framework has a netlink interface to do thermal
25 zones discovery, temperature readings and events such as
26 trip point crossed, cooling device update or governor
27 change. It is recommended to enable the feature.
29 config THERMAL_STATISTICS
30 bool "Thermal state transition statistics"
32 Export thermal state transition statistics information through sysfs.
36 config THERMAL_DEBUGFS
37 bool "Thermal subsystem debug support"
40 Say Y to allow the thermal subsystem to collect diagnostic
41 information that can be accessed via debugfs.
43 config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
44 int "Emergency poweroff delay in milli-seconds"
47 Thermal subsystem will issue a graceful shutdown when
48 critical temperatures are reached using orderly_poweroff(). In
49 case of failure of an orderly_poweroff(), the thermal emergency
50 poweroff kicks in after a delay has elapsed and shuts down the system.
51 This config is number of milliseconds to delay before emergency
52 poweroff kicks in. Similarly to the critical trip point,
53 the delay should be carefully profiled so as to give adequate
54 time for orderly_poweroff() to finish on regular execution.
55 If set to 0 emergency poweroff will not be supported.
61 prompt "Expose thermal sensors as hwmon device"
62 depends on HWMON=y || HWMON=THERMAL
65 In case a sensor is registered with the thermal
66 framework, this option will also register it
67 as a hwmon. The sensor will then have the common
68 hwmon sysfs interface.
70 Say 'Y' here if you want all thermal sensors to
71 have hwmon sysfs interface too.
75 prompt "APIs to parse thermal data out of device tree"
79 This options provides helpers to add the support to
80 read and parse thermal data definitions out of the
83 Say 'Y' here if you need to build thermal infrastructure
86 config THERMAL_WRITABLE_TRIPS
87 bool "Enable writable trip points"
89 This option allows the system integrator to choose whether
90 trip temperatures can be changed from userspace. The
91 writable trips need to be specified when setting up the
92 thermal zone but the choice here takes precedence.
94 Say 'Y' here if you would like to allow userspace tools to
95 change trip temperatures.
98 prompt "Default Thermal governor"
99 default THERMAL_DEFAULT_GOV_STEP_WISE
101 This option sets which thermal governor shall be loaded at
102 startup. If in doubt, select 'step_wise'.
104 config THERMAL_DEFAULT_GOV_STEP_WISE
106 select THERMAL_GOV_STEP_WISE
108 Use the step_wise governor as default. This throttles the
109 devices one step at a time.
111 config THERMAL_DEFAULT_GOV_FAIR_SHARE
113 select THERMAL_GOV_FAIR_SHARE
115 Use the fair_share governor as default. This throttles the
116 devices based on their 'contribution' to a zone. The
117 contribution should be provided through platform data.
119 config THERMAL_DEFAULT_GOV_USER_SPACE
121 select THERMAL_GOV_USER_SPACE
123 The Userspace governor allows to get trip point crossed
124 notification from the kernel via uevents. It is recommended
125 to use the netlink interface instead which gives richer
126 information about the thermal framework events.
128 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
129 bool "power_allocator"
130 depends on THERMAL_GOV_POWER_ALLOCATOR
132 Select this if you want to control temperature based on
133 system and device power allocation. This governor can only
134 operate on cooling devices that implement the power API.
136 config THERMAL_DEFAULT_GOV_BANG_BANG
138 depends on THERMAL_GOV_BANG_BANG
140 Use the bang_bang governor as default. This throttles the
141 devices one step at the time, taking into account the trip
146 config THERMAL_GOV_FAIR_SHARE
147 bool "Fair-share thermal governor"
149 Enable this to manage platform thermals using fair-share governor.
151 config THERMAL_GOV_STEP_WISE
152 bool "Step_wise thermal governor"
154 Enable this to manage platform thermals using a simple linear
157 config THERMAL_GOV_BANG_BANG
158 bool "Bang Bang thermal governor"
161 Enable this to manage platform thermals using bang bang governor.
163 Say 'Y' here if you want to use two point temperature regulation
164 used for fans without throttling. Some fan drivers depend on this
165 governor to be enabled (e.g. acerhdf).
167 config THERMAL_GOV_USER_SPACE
168 bool "User_space thermal governor"
170 Enable this to let the user space manage the platform thermals.
172 config THERMAL_GOV_POWER_ALLOCATOR
173 bool "Power allocator thermal governor"
174 depends on ENERGY_MODEL
176 Enable this to manage platform thermals by dynamically
177 allocating and limiting power to devices.
180 bool "Generic cpu cooling support"
181 depends on THERMAL_OF
183 Enable the CPU cooling features. If the system has no active
184 cooling device available, this option allows to use the CPU
189 config CPU_FREQ_THERMAL
190 bool "CPU frequency cooling device"
194 This implements the generic cpu cooling mechanism through frequency
195 reduction. An ACPI version of this already exists
196 (drivers/acpi/processor_thermal.c).
197 This will be useful for platforms using the generic thermal interface
198 and not the ACPI interface.
200 config CPU_IDLE_THERMAL
201 bool "CPU idle cooling device"
202 depends on IDLE_INJECT
204 This implements the CPU cooling mechanism through
205 idle injection. This will throttle the CPU by injecting
209 config DEVFREQ_THERMAL
210 bool "Generic device cooling support"
211 depends on PM_DEVFREQ
214 This implements the generic devfreq cooling mechanism through
215 frequency reduction for devices using devfreq.
217 This will throttle the device by limiting the maximum allowed DVFS
218 frequency corresponding to the cooling level.
220 In order to use the power extensions of the cooling device,
221 devfreq should use the simple_ondemand governor.
223 If you want this support, you should say Y here.
225 config THERMAL_EMULATION
226 bool "Thermal emulation mode support"
228 Enable this option to make a emul_temp sysfs node in thermal zone
229 directory to support temperature emulation. With emulation sysfs node,
230 user can manually input temperature and test the different trip
231 threshold behaviour for simulation purpose.
233 WARNING: Be careful while enabling this option on production systems,
234 because userland can easily disable the thermal policy by simply
235 flooding this sysfs node with low temperature values.
238 tristate "Generic Thermal MMIO driver"
242 This option enables the generic thermal MMIO driver that will use
243 memory-mapped reads to get the temperature. Any HW/System that
244 allows temperature reading by a single memory-mapped reading, be it
245 register or shared memory, is a potential candidate to work with this
249 tristate "Hisilicon thermal driver"
250 depends on ARCH_HISI || COMPILE_TEST
255 Enable this to plug hisilicon's thermal sensor driver into the Linux
256 thermal framework. cpufreq is used as the cooling device to throttle
257 CPUs when the passive trip is crossed.
260 tristate "Temperature sensor driver for Freescale i.MX SoCs"
261 depends on ARCH_MXC || COMPILE_TEST
262 depends on NVMEM || !NVMEM
263 depends on MFD_SYSCON
266 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
267 It supports one critical trip point and one passive trip point. The
268 cpufreq is used as the cooling device to throttle CPUs when the
269 passive trip is crossed.
271 config IMX_SC_THERMAL
272 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
276 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
277 system controller inside, Linux kernel has to communicate with system
278 controller via MU (message unit) IPC to get temperature from thermal
279 sensor. It supports one critical trip point and one
280 passive trip point for each thermal sensor.
282 config IMX8MM_THERMAL
283 tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
284 depends on ARCH_MXC || COMPILE_TEST
287 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
288 It supports one critical trip point and one passive trip point. The
289 cpufreq is used as the cooling device to throttle CPUs when the passive
293 tristate "Texas Instruments K3 thermal support"
294 depends on ARCH_K3 || COMPILE_TEST
296 If you say yes here you get thermal support for the Texas Instruments
297 K3 SoC family. The current chip supported is:
300 This includes temperature reading functionality.
302 config MAX77620_THERMAL
303 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
304 depends on MFD_MAX77620
307 Support for die junction temperature warning alarm for Maxim
308 Semiconductor PMIC MAX77620 device. Device generates two alarm
309 interrupts when PMIC die temperature cross the threshold of
310 120 degC and 140 degC.
313 tristate "QorIQ Thermal Monitoring Unit"
314 depends on THERMAL_OF && HAS_IOMEM
315 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
318 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
319 It supports one critical trip point and one passive trip point. The
320 cpufreq is used as the cooling device to throttle CPUs when the
321 passive trip is crossed.
324 tristate "SPEAr thermal sensor driver"
325 depends on PLAT_SPEAR || COMPILE_TEST
329 Enable this to plug the SPEAr thermal sensor driver into the Linux
333 tristate "Allwinner sun8i thermal driver"
334 depends on ARCH_SUNXI || COMPILE_TEST
338 depends on RESET_CONTROLLER
340 Support for the sun8i thermal sensor driver into the Linux thermal
343 To compile this driver as a module, choose M here: the
344 module will be called sun8i-thermal.
346 config ROCKCHIP_THERMAL
347 tristate "Rockchip thermal driver"
348 depends on ARCH_ROCKCHIP || COMPILE_TEST
349 depends on RESET_CONTROLLER
352 Rockchip thermal driver provides support for Temperature sensor
353 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
354 trip point. Cpufreq is used as the cooling device and will throttle
355 CPUs when the Temperature crosses the passive trip point.
358 tristate "Renesas R-Car thermal driver"
359 depends on ARCH_RENESAS || COMPILE_TEST
362 Enable this to plug the R-Car thermal sensor driver into the Linux
365 config RCAR_GEN3_THERMAL
366 tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver"
367 depends on ARCH_RENESAS || COMPILE_TEST
371 Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into
372 the Linux thermal framework.
375 tristate "Renesas RZ/G2L thermal driver"
376 depends on ARCH_RENESAS || COMPILE_TEST
380 Enable this to plug the RZ/G2L thermal sensor driver into the Linux
383 config KIRKWOOD_THERMAL
384 tristate "Temperature sensor on Marvell Kirkwood SoCs"
385 depends on MACH_KIRKWOOD || COMPILE_TEST
389 Support for the Kirkwood thermal sensor driver into the Linux thermal
390 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
393 tristate "Temperature sensor on Marvell Dove SoCs"
394 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
398 Support for the Dove thermal sensor driver in the Linux thermal
401 config DB8500_THERMAL
402 tristate "DB8500 thermal management"
403 depends on MFD_DB8500_PRCMU && OF
406 Adds DB8500 thermal management implementation according to the thermal
407 management framework. A thermal zone with several trip points will be
408 created. Cooling devices can be bound to the trip points to cool this
409 thermal zone if trip points reached.
411 config ARMADA_THERMAL
412 tristate "Marvell EBU Armada SoCs thermal management"
413 depends on ARCH_MVEBU || COMPILE_TEST
417 Enable this option if you want to have support for thermal management
418 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
420 config DA9062_THERMAL
421 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
422 depends on MFD_DA9062 || COMPILE_TEST
425 Enable this for the Dialog Semiconductor thermal sensor driver.
426 This will report PMIC junction over-temperature for one thermal trip
428 Compatible with the DA9062 and DA9061 PMICs.
430 menu "Mediatek thermal drivers"
431 depends on ARCH_MEDIATEK || COMPILE_TEST
432 source "drivers/thermal/mediatek/Kconfig"
435 config AMLOGIC_THERMAL
436 tristate "Amlogic Thermal Support"
438 depends on OF && ARCH_MESON
440 If you say yes here you get support for Amlogic Thermal
443 This driver can also be built as a module. If so, the module will
444 be called amlogic_thermal.
446 menu "Intel thermal drivers"
447 depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
448 source "drivers/thermal/intel/Kconfig"
451 menu "Broadcom thermal drivers"
452 depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
454 source "drivers/thermal/broadcom/Kconfig"
457 menu "Texas Instruments thermal drivers"
458 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
460 source "drivers/thermal/ti-soc-thermal/Kconfig"
463 menu "Samsung thermal drivers"
464 depends on ARCH_EXYNOS || COMPILE_TEST
465 source "drivers/thermal/samsung/Kconfig"
468 menu "STMicroelectronics thermal drivers"
469 depends on (ARCH_STI || ARCH_STM32) && OF
470 source "drivers/thermal/st/Kconfig"
473 source "drivers/thermal/tegra/Kconfig"
475 config GENERIC_ADC_THERMAL
476 tristate "Generic ADC based thermal sensor"
479 This enabled a thermal sysfs driver for the temperature sensor
480 which is connected to the General Purpose ADC. The ADC channel
481 is read via IIO framework and the channel information is provided
482 to this driver. This driver reports the temperature by reading ADC
483 channel and converts it to temperature based on lookup table.
485 menu "Qualcomm thermal drivers"
486 depends on (ARCH_QCOM && OF) || COMPILE_TEST
487 source "drivers/thermal/qcom/Kconfig"
490 config UNIPHIER_THERMAL
491 tristate "Socionext UniPhier thermal driver"
492 depends on ARCH_UNIPHIER || COMPILE_TEST
493 depends on THERMAL_OF && MFD_SYSCON
495 Enable this to plug in UniPhier on-chip PVT thermal driver into the
496 thermal framework. The driver supports CPU thermal zone temperature
497 reporting and a couple of trip points.
500 tristate "Temperature sensor on Spreadtrum SoCs"
501 depends on ARCH_SPRD || COMPILE_TEST
503 Support for the Spreadtrum thermal sensor driver in the Linux thermal
506 config KHADAS_MCU_FAN_THERMAL
507 tristate "Khadas MCU controller FAN cooling support"
509 depends on MFD_KHADAS_MCU
513 If you say yes here you get support for the FAN controlled
514 by the Microcontroller found on the Khadas VIM boards.
516 config LOONGSON2_THERMAL
517 tristate "Loongson-2 SoC series thermal driver"
518 depends on LOONGARCH || COMPILE_TEST
521 Support for Thermal driver found on Loongson-2 SoC series platforms.
522 The thermal driver realizes get_temp and set_trips function, which
523 are used to obtain the temperature of the current node and set the
524 temperature range to trigger the interrupt. When the input temperature
525 is higher than the high temperature threshold or lower than the low
526 temperature threshold, the interrupt will occur.